Microscopic Characterization of Temperature Effect on Tensile Fracture of Nano-films Via Molecular Dynamics Simulation
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 95 === Thin film is widely applied to the process of connecting the conducting lines in ultra large integration circuit. With the demand of the component becoming slight, multi-layered, highly dense, high speed operating and the product cost, and the effects of stres...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23645366740461704719 |