Multiple Electrodes Arrayed Dielectrophoretic Chip with Application on Micro-Bead Manipulation

• Main Authors: Fu-ting Chang, 張輔廷
• Other Authors: Yung-chun Lee
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/87381706427326843918

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 95 === This study investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of beads. The underlying operational principle is based on negative-dielectrophoresis force.As different from conventional ones using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed Au middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. In experiments, the results show the chips can successfully trap or manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of sorting, trapping, and manipulating beads. The design, analysis, and fabrication processes are all discussed in details.