Design and analysis of normal and thermal spread antenna consisted of EMC for SD card module and System in Package

• Main Authors: Yei-Shen Wu, 吳怡賢
• Other Authors: Ching-Hsing Luo
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/00742501266973417949

碩士 === 國立成功大學 === 電機工程學系專班 === 95 === A novel antenna suitable to be applied in a mobile device as an internal antenna having an electromagnetic compatibility (EMC) property with nearby conducting elements like System in Package (SiP) is presented. The antenna is easily fabricated from a single metal plate and mainly comprises a top antenna pattern like PIFA, patch, and loop antenna with an inverted-L vertical ground wall. Due to the presence of the inverted-L ground wall, which is perpendicular to the system ground plane of the mobile device, the possible fringing EM fields in the surrounding region of the antenna are suppressed. In this case possible coupling between the antenna and the nearby conducting elements like System in Package (SiP) is expected to be small, and thus degrading effects on the performance of the antenna are eliminated. A design example of the proposed antenna including PIFA, patch antenna and loop antenna for Wireless Local Area Network (WLAN) 2412~2485 MHz operation in mobile devices like SD card module demonstrated and discussed. At the same time, the effect of SAR would be discussed refer to a human head and hand influence refer to antenna performance for mobile devices using like GSM/VOIP/ SKYPE phone application. Finally, the heat spread using traditional BGA for enhanced thermal treats as antenna applying in SiP (System in Package) also discussed.