Design and analysis of normal and thermal spread antenna consisted of EMC for SD card module and System in Package
碩士 === 國立成功大學 === 電機工程學系專班 === 95 === A novel antenna suitable to be applied in a mobile device as an internal antenna having an electromagnetic compatibility (EMC) property with nearby conducting elements like System in Package (SiP) is presented. The antenna is easily fabricated from a single meta...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00742501266973417949 |