Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices
博士 === 國立成功大學 === 微電子工程研究所碩博士班 === 95 === This dissertation divides into three parts: (a) Preparation of thin film microstrip line using low K dielectrics; (b) microwave measurements of the low K dielectric materials and (c) design of filter with metamaterial and with multi-band performance. (a) Pre...
Main Authors: | , |
---|---|
Other Authors: | |
Format: | Others |
Language: | en_US |
Published: |
2007
|
Online Access: | http://ndltd.ncl.edu.tw/handle/99552310754202138481 |
id |
ndltd-TW-095NCKU5428075 |
---|---|
record_format |
oai_dc |
spelling |
ndltd-TW-095NCKU54280752016-05-20T04:17:26Z http://ndltd.ncl.edu.tw/handle/99552310754202138481 Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices 薄膜微帶線與介間物質在微波被動元件之研究 Hung-Wei Wu 吳宏偉 博士 國立成功大學 微電子工程研究所碩博士班 95 This dissertation divides into three parts: (a) Preparation of thin film microstrip line using low K dielectrics; (b) microwave measurements of the low K dielectric materials and (c) design of filter with metamaterial and with multi-band performance. (a) Preparation of thin film microstrip line using low K dielectrics In the first part of the dissertation, we propose a detailed fabricating process and characterization of thin film microstrip line (TFML) on low K polyimide. By incorporating a spin-on dielectric polyimide and sputtering of aluminum, the TFML is fabricated on low cost low resistivity silicon (LRS) substrate ( ), the TFML with a thickness of 20μm polyimide dielectric layer presents attenuation losses of 0.385 dB/mm at 25 GHz and 0.438 dB/mm at 50 GHz. Effective dielectric constants, loss tangent and average power handling capability (APHC) of TFML on polyimide are carefully investigated and discussed. Additionally, the microwave characteristics of the dc-biased TFML were studied. This characterization of the TFML can be extensively applied on the interconnection of radio frequency integrated circuit (RFIC). (b) Microwave measurements of the Low K dielectric materials In the second part of the dissertation, we present a novel finite ground microstrip line to develop and to measure the microwave properties of TFML. By using the high frequency on-wafer and transmission line measurement technique, the low K dielectric can be accurately determined in the microwave properties and APHC under the condition for without dc-bias and with dc-bias. Especially in the case with dc-bias that can effectively evaluate the possibility of RF SoC. (c) Filter design with metamaterial and with multi-band performance In the third part of the dissertation, we discuss the propagation characteristics of single complementary split-ring resonator (CSRR) in planar transmission media. We also applied the periodic CSRRs to suppress the harmonics of the conventional dual-mode ring bandpass filter (BPF) by using the propagation characteristics of the periodic CSRRs. Additionally, we present a dual-band filter using stepped impedance resonator (SIR). The BPF has good dual-passband performances at 2.4 / 5.2 GHz and high isolation between the two passbands. The dual-band BPF has a smaller area and lower insertion loss in comparison of previous works. Finally, some suggestions are made in the future work on technology for system on chip (SoC). Yan-Kuin Su Min-Hang Weng 蘇炎坤 翁敏航 2007 學位論文 ; thesis 149 en_US |
collection |
NDLTD |
language |
en_US |
format |
Others
|
sources |
NDLTD |
description |
博士 === 國立成功大學 === 微電子工程研究所碩博士班 === 95 === This dissertation divides into three parts: (a) Preparation of thin film microstrip line using low K dielectrics; (b) microwave measurements of the low K dielectric materials and (c) design of filter with metamaterial and with multi-band performance.
(a) Preparation of thin film microstrip line using low K dielectrics
In the first part of the dissertation, we propose a detailed fabricating process and characterization of thin film microstrip line (TFML) on low K polyimide. By incorporating a spin-on dielectric polyimide and sputtering of aluminum, the TFML is fabricated on low cost low resistivity silicon (LRS) substrate ( ), the TFML with a thickness of 20μm polyimide dielectric layer presents attenuation losses of 0.385 dB/mm at 25 GHz and 0.438 dB/mm at 50 GHz. Effective dielectric constants, loss tangent and average power handling capability (APHC) of TFML on polyimide are carefully investigated and discussed. Additionally, the microwave characteristics of the dc-biased TFML were studied. This characterization of the TFML can be extensively applied on the interconnection of radio frequency integrated circuit (RFIC).
(b) Microwave measurements of the Low K dielectric materials
In the second part of the dissertation, we present a novel finite ground microstrip line to develop and to measure the microwave properties of TFML. By using the high frequency on-wafer and transmission line measurement technique, the low K dielectric can be accurately determined in the microwave properties and APHC under the condition for without dc-bias and with dc-bias. Especially in the case with dc-bias that can effectively evaluate the possibility of RF SoC.
(c) Filter design with metamaterial and with multi-band performance
In the third part of the dissertation, we discuss the propagation characteristics of single complementary split-ring resonator (CSRR) in planar transmission media. We also applied the periodic CSRRs to suppress the harmonics of the conventional dual-mode ring bandpass filter (BPF) by using the propagation characteristics of the periodic CSRRs. Additionally, we present a dual-band filter using stepped impedance resonator (SIR). The BPF has good dual-passband performances at 2.4 / 5.2 GHz and high isolation between the two passbands. The dual-band BPF has a smaller area and lower insertion loss in comparison of previous works.
Finally, some suggestions are made in the future work on technology for system on chip (SoC).
|
author2 |
Yan-Kuin Su |
author_facet |
Yan-Kuin Su Hung-Wei Wu 吳宏偉 |
author |
Hung-Wei Wu 吳宏偉 |
spellingShingle |
Hung-Wei Wu 吳宏偉 Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices |
author_sort |
Hung-Wei Wu |
title |
Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices |
title_short |
Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices |
title_full |
Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices |
title_fullStr |
Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices |
title_full_unstemmed |
Study of Thin Film Microstrip Line and Metamaterial on Microwave Passive Devices |
title_sort |
study of thin film microstrip line and metamaterial on microwave passive devices |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/99552310754202138481 |
work_keys_str_mv |
AT hungweiwu studyofthinfilmmicrostriplineandmetamaterialonmicrowavepassivedevices AT wúhóngwěi studyofthinfilmmicrostriplineandmetamaterialonmicrowavepassivedevices AT hungweiwu báomówēidàixiànyǔjièjiānwùzhìzàiwēibōbèidòngyuánjiànzhīyánjiū AT wúhóngwěi báomówēidàixiànyǔjièjiānwùzhìzàiwēibōbèidòngyuánjiànzhīyánjiū |
_version_ |
1718272171747311616 |