Effect of Surfactants on the Electroforming Processed Metallic Mold for Imprinting Technology
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 95 === A metallic mould can replace the Si mould to solve the problem that Si mould is too brittle to endure the cyclic imprinting process. Nickel mould was fabricated by nickel electroforming on electroless Ni-P thin film plated on polymer (photoresist Shipley S1...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/48191382441525138768 |