Optimal Design on Twin Die Stacked Packages Using Regression Analysis
碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === Along with the vigorous development of the electronic products market and the consumer’s preference for products with smaller size, the structure of 3D stacked die package rapidly becomes popular. Thus the stacked behavior of the silicon dies always makes the c...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20368361861826482142 |