The effect of PCB thermal layer area and copper column on the heat transfer characteristic of QFN package
碩士 === 國立中興大學 === 機械工程學系所 === 95 === Abstract Because POL has direct current to direct current (DC/DC) design, its inner control chip will die from switching, which could cause power loss and produce heat. If the heat cannot be dissipated or removed by appropriate means, the temperature will go...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/14270416734128545522 |