| Summary: | 碩士 === 國立中興大學 === 機械工程學系所 === 95 === Abstract
Because POL has direct current to direct current (DC/DC) design, its inner control chip will die from switching, which could cause power loss and produce heat. If the heat cannot be dissipated or removed by appropriate means, the temperature will go higher and higher and therefore, affects the efficiency of POL. And the high temperature of IC in Pulse Wide Modulation (PWM) will increase continuously and will cause damage to the switching. The heat conduction way differs with different package. Quad Flat Non-leaded (QFN) package heat conduction depends on PCB, which is further discussed in this thesis. In addition, with the tendency of choosing light, thin, short, tiny electronic items among consumers, electronic companies are developing smaller and smaller productions for easy use. Thus, depending on PCB to remove heat energy in an restricted space is the main discuss in this thesis.
This come from CFD(Computational Fluid Dynamics) systems and Flotherm tools. It can change the size and thickness, themal via supply, amount and produce systems heat thermal layer to require heat and quality. Compare to CFD, it have make a quality.
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