Machining characteristics of ceramics using wire saw

• Main Authors: Chien-Lung Huang, 黃乾隆
• Other Authors: Dr.Chun-Yao Hsu
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/07789955232057523805

碩士 === 龍華科技大學 === 工程技術研究所 === 95 === Wire-saw machining is a technique that uses free abrasives to cut semiconductors, crystals, various single crystals, oxide semiconductors, as well as magnetic and ceramic materials. This study analyzes machining ceramic properties (Al2O3) using wire-saw machining aided by ultrasonic vibration. Taguchi experimental design was adopted to identify the influence of machining parameters on machining characteristics. Signal-to-noise (S/N) ratio and analysis of variance (ANOVA) are employed to investigate performance characteristics during cutting operations. Results show that wire swinging produces higher material removal rate and good wafer surface roughness. Ultrasonic-aided vibration improves material removal rate, and little flatness difference exists under different machining conditions. Furthermore, optimal wire-saw machining parameters based on grey relational analysis can be determined effectively thereby improving multiple cutting qualities.