| Summary: | 碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 95 === How to efficiently improve the residual heat removal of electronic devices with high power density has been becoming the highly concerned issue. The present study has focused on the development of a mini-channel evaporator for electronic cooling. The reliability of electronic products has been enhanced due to its characteristics of high capability in heat removal under the operation condition of more uniform temperature. Furthermore, less pumping power is required because mini-channel evaporator has a much lower pressure drop in comparison with the micro-channel design.
In order to fully understand the heat transfer mechanism, a closed, visualized test loop has been setup to implement the experiments. Two copper made test sections with the area of 30mm×30mm were carved with mini-scale of channels. One has 14 rectangular shaped channels and the other one has 18 channels with the shape of diffuser. The rectangular one has the dimension of 1mm×3mm; the diffuser one has the dimensions of 0.5mm×0.3mm at inlet and 1mm×3mm at outlet. Water has been employer as the working fluid and the pressure across the test section pressure is in the range of 25kPa.
The experiment results indicate that, mini-channel evaporator can remove the heat flux up to 16 W/cm2 with the temperatures of a heated surface less than 60℃ at the flow rate as small as 20ml/min before the occurrence of dryout. Both shapes of mini-channel perform pressure drop less than 1kPa for the flow rate between 20~80 ml/min. The one with the channel shape of diffuser performs better in heat transfer because the bubbles flow through the channels more smoothly.
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