Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques
碩士 === 義守大學 === 電機工程學系碩士班 === 95 === Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. Usually, full wave electromagnetic wave simulator is applied to simulate the effect o...
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| Format: | Others |
| Language: | zh-TW |
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2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66994702058679935413 |
| Summary: | 碩士 === 義守大學 === 電機工程學系碩士班 === 95 === Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. Usually, full wave electromagnetic wave simulator is applied to simulate the effect of packaging. Full wave electromagnetic wave simulation requires long simulation time and is less flexiable to structure modification. In this thesis we propose a new approach that uses neural network to determine the the lumped element models of bonding pads and use circuit simulator to simulate the packaging effect. Comparing with full wave electromagnetic wave simulation, the new approach is faster, more flexible and the accuracy is preserved. As an example, an RF SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave simulator.
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