The study on reliability and optimization of IC package in temperature shack conditions of interface strength by the fuzzy logic in taguchi technique

• Main Authors: Ting-Xuan Su, 蘇廷軒
• Other Authors: Thaiping Chen
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/00568231840427434575

碩士 === 和春技術學院 === 電機工程研究所 === 96 === In electronic packages, the crack existence may cause the structure damage subjected to the thermal loading. The electronic package can be considered as the composite structure because of the layer manufacturing. The thermal shear occurs in the interface of the layers due to the unmatched coefficient of thermal expansion (C.T.E.) of the materials subjected to the temperature change. In this research, three controllable factors are dwell time, solder mask thickness and shock temperature. These are based on JESD22-A106B standard. Two uncontrollable factors are delamination force (N) and energy absorption (J). Using the temperature shock is simulated for environment temperature destruction, the interface adhesion strength by using the shear test and dropped destruction by using the impact test. Analysis of variance (ANOVA) is used to find significant factors and the most damaged conditions. Finally interface adhesion strength and energy absorption are unified by the fuzzy logic to analyze multiple performance characteristics index (MPCI). MPCI result is the only index of the specimen quality levels to define temperature effects to interface adhesion strength of the substrate/solder mask for tremendous influence conditions.