Simulation and Test of the Thermal Fatigue Life of an Electronic Package
碩士 === 逢甲大學 === 航太與系統工程所 === 95 === The study focuses on the reliability of wafer level chip scale package (WLCSP) subjected to cyclic temperature. The finite element analysis (FEA) is used to simulate its thermal condition and the mechanical behavior. According to the theory of an energy-based law...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/83583922283927175014 |