Effects of EMC Compositions on Gold Bond Intermetallic compound in IC Package Process
碩士 === 逢甲大學 === 材料與製造工程所 === 95 === IC should be designed for the circuit connection to the main board that can be operated well. There are two package material such as plastic and ceramic. Price and mass production considered, plastic package has been the major type of IC package.[1] EMC (Epoxy Mo...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67012995703476778030 |