A Study of Improving PCB Artwork Quality via Six Sigma DMAIC Approach

• Main Authors: Ying-Chung Chen, 陳瀅中
• Other Authors: Fong-Jung Yu
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/02424569116713816462

碩士 === 大葉大學 === 工業工程與科技管理學系碩士在職專班 === 95 === The inner layer artwork of the multi-layer PCBs is an advance step in the manufacturing process of the PCBs industry. It is a key item to produce the inner layer artwork. The advantages of using artwork in PCB process are extremely good for the application to high density circuit design. Due to the structure of the products of inner layer PCB, they are not easy to rework or repair. Each step of the PCB process needs extra deliberation and carefulness；otherwise, there will be increase of inner failure cost. On the other hand, the on time rate of the inner artwork is very important, too. This will allow us to avoid delays to the production of our finished goods. One of the essences of Six Sigma is to upgrade the process quality to the worldwide standard by means of process management. Combined with statistical quality control methods, it achieves the quality goal of a failure rate lower than 3.4ppm. The ideal goal of “zero defects” has come true by use of this scientific method. Base on this, this research is to study to promote the project quality and on time rate in inner layer artwork of PCB. By use of 6 Sigma DMAIC approach, to reduce the inner failure cost and promote the achieve date and study target of constitution improvement. This research can be a useful reference to corporations of PCB that need to carry out inner layer artwork improvement.