A Study of Order Release with Limited Capacity in IC Package Factory
碩士 === 中原大學 === 工業工程研究所 === 95 === Order release is crucial to the performance of IC packaging factories where wire bond is a typical bottleneck process in this industry. This research proposes an order release policy based on finite capacity to determine the sequence of orders and product types to...
Main Authors: | Ming-Chi Hsiao, 蕭明誌 |
---|---|
Other Authors: | James C. Chen |
Format: | Others |
Language: | zh-TW |
Published: |
2007
|
Online Access: | http://ndltd.ncl.edu.tw/handle/23431159134462103055 |
Similar Items
-
Short term Order and Machine Assignment Problem for IC-Packaging Factory
by: 黃思孟
Published: (2012) -
Machine Allocation Problem of IC-Packaging Factory
by: Chan, Jennifer, et al.
Published: (2011) -
Competitive Strategic Planning for IC Packaging and Testing Factory-A Case Study of an IC Packaging and Testing Company in Hsinchu
by: CHIU,CHIH-WEI, et al.
Published: (2014) -
A Study of Capacity Planning for IC packaging
by: Mei-Fang Hsu, et al.
Published: (2005) -
The Construction of Mid-term Production Planning System for IC Packaging Factories
by: Dai, Yu-Ting, et al.
Published: (1998)