A Study of Order Release with Limited Capacity in IC Package Factory
碩士 === 中原大學 === 工業工程研究所 === 95 === Order release is crucial to the performance of IC packaging factories where wire bond is a typical bottleneck process in this industry. This research proposes an order release policy based on finite capacity to determine the sequence of orders and product types to...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23431159134462103055 |
| Summary: | 碩士 === 中原大學 === 工業工程研究所 === 95 === Order release is crucial to the performance of IC packaging factories where wire bond is a typical bottleneck process in this industry. This research proposes an order release policy based on finite capacity to determine the sequence of orders and product types to be processed by wire bond machines. On-time delivery rate and machine utilization are used to evaluate the performance of the proposed policy. A case study using data from real IC package factories was conducted and the design of experiments was used to evaluate the effectiveness of the proposed order release policy. Simulation results show that, compared to traditional order release alternatives, the proposed order release policy can significantly improve the IC packaging performance.
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