The Effect of Bond Spans and Heights on the Sweep Stiffness of Wire Bond at Elevated Temperatures
碩士 === 正修科技大學 === 機電工程研究所 === 95 === Abstract At the present days, the trend of electric component is toward multi-function, high speed, high reliability and low cost, so Multi-Chip Module(MCM) and 3-Dimensional Package are the preferred choice in the development of semiconductor package. A Mu...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34891916938556228749 |