| Summary: | 碩士 === 正修科技大學 === 機電工程研究所 === 95 === Abstract
At the present days, the trend of electric component is toward multi-function, high speed, high reliability and low cost, so Multi-Chip Module(MCM) and 3-Dimensional Package are the preferred choice in the development of semiconductor package.
A Multi-Chip Module (MCM) or 3-Dimensional Package can combine multiple ICs into a single system-level unit, capable of handling an entire function. Up to the present, wire bonding technology is adopted for MCM and 3-D package that provides versatile, reliable and low cost chip connection technology.
While producing IC packages, even a slight amount of wire sweep will cause wires to touch each other. It will be an important problem in IC package that how to effectively avoid wire sweep.
Thus, this study further emphasized on this issue. Firstly, the wire bond spans and the bond heights of specimen were measured by a 3-D microscope.
In wire sweep experiments, a high-temperature chamber and micro sweep test machine were used to measure sweep displacement and sweep stiffness resulted from mold flow drag force in high temperature during IC packaging.
The numerical analysis is conducted to testify the results of experiments. Based on the numerical results of ANSYS and Kung’s equation, the effect of bond span and bond height on wire sweep for difference wire loop modes can be obtained and they are compared with experiment results.
The analytical results indicate that the temperature, bond span and wire diameters of wire loop modes will affect the wire sweep significantly.
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