Studies of Characteristics on Bond Wire Structuresfor RF and Microwave Circuit Application
碩士 === 元智大學 === 通訊工程學系 === 94 === At the beginning, the S-parameters of a gold wire bonded in air to two microstrip lines are validated by measurements using a vector network analyzer and HFSS software simulations at frequencies of 0.04~6.0 GHz. Based on good agreement between the simulation and me...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83495675260982012754 |
| Summary: | 碩士 === 元智大學 === 通訊工程學系 === 94 === At the beginning, the S-parameters of a gold wire bonded in air to two microstrip lines are validated by measurements using a vector network analyzer and HFSS software simulations at frequencies of 0.04~6.0 GHz. Based on good agreement between the simulation and measurement results for a gold bond-wire, the HFSS software is used to study return loss for three types of arching ribbon- and bond-wire structures. From simulation results, it is found that an arching bond-wire with a smaller arc angle can minimize the return loss. It is also found that the return loss can be improved and operation frequency shifts can be achieved by using multiple wires place in parallel in bond-wire arrays. It is also found that return losses calculated by using ribbon-wire structures are better than those obtained by using bond-wire arrays. Finally, an equivalent circuit is proposed to model bond-wire structures at frequencies of 0.04~6.0 GHz. Elements in the equivalent circuit are obtained by employing a curve fitting technique together with Newton’s Iteration method to approximate the impedance response obtained from transforming the measured S-parameters.
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