Application of Taguchi Method to Optimize the Design for Measuring Parameters of Ball Grid Array Package
碩士 === 大同大學 === 機械工程學系(所) === 94 === English Abstract In the BGA set-up technology, the solder balls need highly positional precision, especially in the height. If not, the solder ball’s top will be in-coplanar. The bad contact between the solder ball and a circuit board will bring about a leakage c...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71523738824034942610 |