| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 94 === With the progress of electro-optical technology and biotechnology, micro-system technique has been developed for the production and the mass production can be achieved by injection modeling. One of the effective methods to manufacture plastic and ceramic parts is micro injection modeling.
The micro mold after forming of electroform needs the increasing thickness process which inset in the block and supports the micro mold during the injection modeling. Otherwise, the buffer layers could prevent the problems of stresss and surface deterioration. However, the molds are brazed with increasing thickness materials by brazing of micro mold, it will lead the micro mold to be soft and rised internal stress.
In this study, direct current (DC) sputtering and arc ion plating (AIP) were used to design the process of Ag/In transit liquid phase diffusion bonding. At first, the intermetallic phase was produced by the diffusion with low-melt point indium and silver. The melting point and strength of the bonding area will be enhanced. The structures were observed using SEM and OM, XRD and EPMA were used to identify the quality and quantification, respectively. The arc ion plating layers treated by 48 hours treatment could produce the Ag3In phase and InNi phase used for high temperature environment effectively and the structure of the layers is more homogenous. Hence, the micro mold after increasing thickness process is applied on a high temperature environment using the transient liquid phase diffusion bonding the tool steels and electroformed nickel plates at low temperature of 230℃.
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