The Study of Electroless Deposition of Ni-Mo-P Ternary Alloy
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 94 === This research of uses inductively coupled plasma spectroscopy (ICP) to measure the composition of the film. Scanning electron microscope (SEM ) assesses the thickness of the plating and deposition speed. X-ray diffraction (XRD ) analyzes crystalline or amorphou...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30966132149168403881 |
| Summary: | 碩士 === 國立聯合大學 === 化學工程學系碩士班 === 94 === This research of uses inductively coupled plasma spectroscopy (ICP) to measure the composition of the film. Scanning electron microscope (SEM ) assesses the thickness of the plating and deposition speed. X-ray diffraction (XRD ) analyzes crystalline or amorphous structures. Auger electron spectroscopy (AES) checks copper diffusion. ICP controls plating composition and explains XRD analyses. XRD result explains copper diffusion.
This study makes clear component relationship of electroless bath, such as NiSO4、NaH2PO2 、Na2MoO4 and complex agents. This result of plating under control is better. After heat treatment , the result finds plating of molybdenum to increases heat stability。Phosphorous increases to keep amorphous easily。In Ni-Mo-P electroless plating， phosphorou content is very important to copper diffusion barrier 。In the future the field of copper diffusion barrier may have chance to improve。This research of copper diffusion barrier to Ni-Mo-P electroless has no significant effect because film is very thin。
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