A study of the bonding performance for epoxy base prepreg adhesive to porous oxide film of aluminum alloy

• Main Authors: Yean-ho Liao, 廖原禾
• Other Authors: Hsien-tang Chiu
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/2ey6z7

碩士 === 國立臺灣科技大學 === 材料科技研究所 === 94 === This study purposely covers how the microstructure of porous oxide film effects the bond performance of aluminum alloy panels, which are fabricated through several processes such as various surface treatments chromic anodizing, hot etching, sulfuric anodizing and hard anodizing, bonding with prepreg epoxy base adhesive by selecting process parameters, fixing process, and curing. The test results reveal that chromic anodized test panel presents best bond performance, the sulfuric anodized and hard anodized exhibits worst bond performance, however, the bond performance of the hot etched is between the chromic anodized and the sulfuric anodized. The better bond performance is due to larger bore diameter of the porous oxide film, higher porosity density, i.e., the bond performance improves with the increase of contact surface area. According to the failure mode of the bond face, bonding strength, high temperature and low temperature performance testing, and the analysis of the microstructure of porous oxide film, it is concluded that the chromic anodized aluminum test panel behaves the best bond performance.