A Study of Droplet Evaporation on Substrates by Different Cleaning Methods

• Main Authors: Chih-Po Kao, 高智柏
• Other Authors: An-Bang Wang
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/15203407042548359131

碩士 === 國立臺灣大學 === 應用力學研究所 === 94 === Droplet evaporation is a basic natural phenomena, and has a lot of applications. In many experiment procures, reside effects the result. Therefore, it is important to know how to control distribution of particles in industry or in research. There are two main parts in this journal, the first one is the substrate cleaning and the second is droplet evaporation. We improve there are two distinct behaviors on different cleaning substrates when evaporating. When droplet evaporates on unclean or wet clean substrate, the droplet pins with bad repeatability; on the other hand, dry clean gets unpin type with repeatability. It also be found on hydrophobic substrates. Besides, pining is relative to particle concentration. When particle concentration is more than 5×10-3%, the unpin droplet is pinned on cleaning substrates. Concentration increases, terminal area shrink velocity at the same pressure increases, too; under the same concentration, terminal area shrink velocity at 0.4 atm is triple that at 1atm.