Characterization of Mechanical Properties of Thin Film and Intermetallic Compound for Lead-Free Flip Chip Packages
博士 === 國立臺灣大學 === 應用力學研究所 === 94 === Technologies for flip chip bonding boomed to meet the requirement of smaller packages with higher performance that can sustain a substantially high temperature even under normal operating conditions. The coefficient of thermal expansion (CTE) mismatch between the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99393163889576934114 |