| Summary: | 碩士 === 國立臺灣大學 === 機械工程學研究所 === 94 === The increase that the electronic product makes performance and processing speeds constant with the progress of science and technology, in order to accord with the demand of industry, but electronic product can produce a large amount of heat energy too in while in high-speed computation, so how make heat energy valid to is it produce to come loose under the area in limited heat dissipation, becoming a ring which can''t be ignored in the electronic product design at present, the most frequently used way is one slice of associations of fan fin now, because the heat energy of the electronic product is higher and higher in density, and the heat dissipation performance of slice of fan fin has already been close to the bottleneck, so research Two Phase Close Thermosyphon Cooling System
as the heat dissipation to try, research this heat dissipation mould group behavior difference, heat dissipation of performance under different experiment parameter by way of experiment, find out this heat dissipation optimization, mould of group design, two phase flow closed thermosyphon heat dissipation system can divide into person who evaporate, condensation department, convection department three major part mainly, its operation principle is to utilize the liquid job fluid in the evaporating department to produce the looks change in order to absorb a large amount of heat energy, turn into job fluid of gaseous state will rise to condensation department and is it condense hot fast release among the external world to produce ancient piece of jade. The experiment parameter of this experiment has surface structure of filling rate, the heating rate of the simulation heat source, evaporating department baseplate of the heat dissipation system, study every experiment heat dissipation performance of parameter display in order to improve direction of system this as future, found this system has good heat dissipation performance to the high heating rate by the experimental result, because electronic product higher and higher in density to heat energy at present once, this experiment heat dissipation system has very fine heat dissipation to behave to apply to electronic cooling.
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