The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure
碩士 === 國立清華大學 === 電子工程研究所 === 94 === In this paper, we present the design, fabrication, and characterization of CMOS micromachined cantilevers for mass sensing in the femto-gram range. The cantilevers consisting of multiple metal and dielectric layers are fabricated after completion of the conventio...
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ndltd-TW-094NTHU54280562015-12-16T04:39:05Z http://ndltd.ncl.edu.tw/handle/65454301643304475786 The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure 利用懸臂樑結構設計與製作之CMOS-MEMS微質量感測器 Ying-Chung Li 李應崇 碩士 國立清華大學 電子工程研究所 94 In this paper, we present the design, fabrication, and characterization of CMOS micromachined cantilevers for mass sensing in the femto-gram range. The cantilevers consisting of multiple metal and dielectric layers are fabricated after completion of the conventional CMOS process by dry etching steps. The cantilevers are electrostatically actuated to resonance by in-plane electrodes. The frequency shift due to mass loading is detected capacitively with on-chip circuitry, in which the modulation technique is used to eliminate the capacitive feedthrough from the driving port, and to lessen the effect of the flicker noise. The highest resonant frequency of the cantilevers is measured at 396.6 kHz with a quality factor of 2500. Mass loading on cantilevers is completed by deposition of a 0.1-mm SiO2 layer. The maximum frequency shift after deposition is 140 Hz, averaging 350 fg/Hz. Shiang-Cheng Lu 盧向成 2006 學位論文 ; thesis 66 zh-TW |
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碩士 === 國立清華大學 === 電子工程研究所 === 94 === In this paper, we present the design, fabrication, and characterization of CMOS micromachined cantilevers for mass sensing in the femto-gram range. The cantilevers consisting of multiple metal and dielectric layers are fabricated after completion of the conventional CMOS process by dry etching steps. The cantilevers are electrostatically actuated to resonance by in-plane electrodes. The frequency shift due to mass loading is detected capacitively with on-chip circuitry, in which the modulation technique is used to eliminate the capacitive feedthrough from the driving port, and to lessen the effect of the flicker noise. The highest resonant frequency of the cantilevers is measured at 396.6 kHz with a quality factor of 2500. Mass loading on cantilevers is completed by deposition of a 0.1-mm SiO2 layer. The maximum frequency shift after deposition is 140 Hz, averaging 350 fg/Hz.
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Shiang-Cheng Lu |
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Shiang-Cheng Lu Ying-Chung Li 李應崇 |
author |
Ying-Chung Li 李應崇 |
spellingShingle |
Ying-Chung Li 李應崇 The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure |
author_sort |
Ying-Chung Li |
title |
The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure |
title_short |
The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure |
title_full |
The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure |
title_fullStr |
The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure |
title_full_unstemmed |
The Design and Fabrication of CMOS MEMS Mass Sensor Using Cantilever Beam Structure |
title_sort |
design and fabrication of cmos mems mass sensor using cantilever beam structure |
publishDate |
2006 |
url |
http://ndltd.ncl.edu.tw/handle/65454301643304475786 |
work_keys_str_mv |
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