A study of electrical properties of Sn63Pb37 and Sn95.5Ag4Cu0.5 solder joints in thermoelectric modules
碩士 === 國立清華大學 === 材料科學工程學系 === 94 === Thermoelectric elements and metallic conductors are connected by soldering reaction in thermoelectric cooling module. Owing to miniaturization of thermoelectric cooling modules, the size of thermoelectric elements is also decreasing. The contact resistance betwe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66004762124251106994 |