Parametric Study of Solder Ball due to Impact Test
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 94 === With the electronic packaging towards the rapid development of lead free process, the related research on the portable electronic devices subject to impact load is emphasized urgently. At present, the failure modes of fracturing in IMC layer and fracturing o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80982908412869457857 |