Ge floating dot memory

碩士 === 國立中央大學 === 電機工程研究所 === 94 === Abstract In this thesis, we utilize the method of thermal oxidation poly SiGe to form Ge nanocrystals and then fabricate the Ge nanocrystals transistor. In the process of fabrication, we have also developed the undestructive method to check surface state of the s...

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Main Authors: Jung-Hsiuan Wu, 吳榮軒
Other Authors: 李佩雯
Format: Others
Language:zh-TW
Online Access:http://ndltd.ncl.edu.tw/handle/7z2a72
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spelling ndltd-TW-094NCU054420562018-05-18T04:28:48Z http://ndltd.ncl.edu.tw/handle/7z2a72 Ge floating dot memory 鍺浮點記憶體之研製 Jung-Hsiuan Wu 吳榮軒 碩士 國立中央大學 電機工程研究所 94 Abstract In this thesis, we utilize the method of thermal oxidation poly SiGe to form Ge nanocrystals and then fabricate the Ge nanocrystals transistor. In the process of fabrication, we have also developed the undestructive method to check surface state of the sample by Ellipsometer. Besides, the gate etching in formation of Ge nanocrystals transistor is very important. Because removing Ge nanocrystals embedded in gate stacked greatly effects the following fabrication and characteristics of device. We have fabricated Ge nanocrystals MOS capacitors and FET by using the method of thermal oxidation poly SiGe to form Ge nanocrystals. After formation, we take some measurements included capacitance measurement, Retention time measurement, pulse width measurement and endurance measurement. According to the result of measurements we can easily realize the characteristics of our device and the problems of device structure. 李佩雯 學位論文 ; thesis 60 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立中央大學 === 電機工程研究所 === 94 === Abstract In this thesis, we utilize the method of thermal oxidation poly SiGe to form Ge nanocrystals and then fabricate the Ge nanocrystals transistor. In the process of fabrication, we have also developed the undestructive method to check surface state of the sample by Ellipsometer. Besides, the gate etching in formation of Ge nanocrystals transistor is very important. Because removing Ge nanocrystals embedded in gate stacked greatly effects the following fabrication and characteristics of device. We have fabricated Ge nanocrystals MOS capacitors and FET by using the method of thermal oxidation poly SiGe to form Ge nanocrystals. After formation, we take some measurements included capacitance measurement, Retention time measurement, pulse width measurement and endurance measurement. According to the result of measurements we can easily realize the characteristics of our device and the problems of device structure.
author2 李佩雯
author_facet 李佩雯
Jung-Hsiuan Wu
吳榮軒
author Jung-Hsiuan Wu
吳榮軒
spellingShingle Jung-Hsiuan Wu
吳榮軒
Ge floating dot memory
author_sort Jung-Hsiuan Wu
title Ge floating dot memory
title_short Ge floating dot memory
title_full Ge floating dot memory
title_fullStr Ge floating dot memory
title_full_unstemmed Ge floating dot memory
title_sort ge floating dot memory
url http://ndltd.ncl.edu.tw/handle/7z2a72
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