A Study on the IC Package Type Migration with Technological Forecasting Method on Digital Life Trend

• Main Authors: Gary S.P. Liu, 劉頌斌
• Other Authors: Benjamin J. C. Yuan
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/22646420791363366636

碩士 === 國立交通大學 === 管理學院碩士在職專班科技管理組 === 94 === According to the rapid progress of digital technology and economics growing, the world is entering a new digitalized life style. Since the social structure is going to change, people may have more choices for more convenient digital life. Hence, digital products are rapidly developing, people may access more information at anywhere. Regarding future digital life style forecasting, there are many related researches involved. Regarding the future digital products & trend, there are many worldwide organizations are discussing the standards and are defining the specification. But for the digital products producing, there are few researches study the required function, technology maturity and the technology development trend. Through this research, will be started on the future digital life style study. Then, collected the necessary functions from the digital life scenario. And found out the seed technologies using MRI technology forecasting method, as well as the technical survey from IC packaging specialists. However, this research is focus on IC packing field, the IC packaging key technologies for future digital products will be found accordingly. According the result, the IC packaging technology development direction will be determined finally. Some suggestions on future products development and industry research direction will be proposed. Hope this research could provide the new development direction for Taiwan semiconductor industry. And result to build up the new competitive strength and core competition.