Effects of Indium Addition on the Joint of Lead-Free Sn-Ag-Sb Solder
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 94 === The goal of this research is to evaluate the effects of adding 1, 5, 10wt.% Indium into Sn-Ag-Sb lead-free solders on melting point, microstructure, wettability, microhardness and the interfacial reaction with Cu substrate. Furthermore, the single lap specimen...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38036813093319930581 |