Fabrication of the Underwater Acoustic Sensor by using one-step Deep Reactive-Ion Etching process

碩士 === 國立成功大學 === 系統及船舶機電工程學系碩博士班 === 94 === This study reports a novel design of a MEMS type underwater acoustic sensor using 6”single-crystalline silicon wafer. At resonant frequent of the membrane structure , a high signal-to-noise ratio is expected by chemical vapor deposition thin layers of si...

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Bibliographic Details
Main Authors: Hsieh-Yu Lee, 李協宇
Other Authors: Ru-Min Chao
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/86454585656291712810