Effects of Microstructure on the Vibration Fracture Characteristics of Sn-xCu and Sn-0.4Cu-0.3Ni Lead-Free Solder Alloys
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 94 === The solder may be damaged under the circumstances of mechanical vibration, particularly when the vibrational frequency approaches the resonant frequency of the structure. So it is worthwhile to know the vibration-fracture resistance of the solder during all...
Main Authors: | Nien-Ting He, 何念葶 |
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Other Authors: | Li-Hui Chen |
Format: | Others |
Language: | zh-TW |
Published: |
2006
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Online Access: | http://ndltd.ncl.edu.tw/handle/39976357578492378183 |
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