A Study of Thermal Performance of the Computer Water-cooling System

• Main Authors: Lu-An Chen, 陳律安
• Other Authors: Long-Sun Chao
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/98909866930187156243

碩士 === 國立成功大學 === 工程科學系碩博士班 === 94 === 　With the progress of semiconductor technology, the computer performance is promoted rapidly, but it's also becoming serious in the heat-dissipation problem. In order to solve this problem, this work studied the water-cooling system, which is expected to be helpful to the heat-dissipation of computer. 　This thesis is partitioned into four subjects: (1) the influence comparison of different controlled parameters in a water-cooling system, (2) the comparison of thermal performance of air, heat-pipe and water cooling systems, (3) the comparison of thermal performance of water- and air-cooling systems in a personal computer, (4) the parameter design of water-cooling system and the related variation of thermal performance. 　According to the analysis results, the influence sequence of controlled parameters on thermal performance is fan speed > amount of water in the tank > internal diameter of tube > length of tube > k value of thermal compound > ambient temperature, and the effects of coolant type and the height drop of tube could be ignored. 　The analysis results can be applied to the real computers. Since the power-line-supported notebook uses very small space to design a cooling system, the varying ranges of controlled parameters will be limited. However, according to the analysis results, the thermal resistance of the cooling system could be lower than that of a CPU-frequency-decelerated desktop computer by increasing the fan speed. Besides, a battery-supplied notebook would save power by slowing down the fan speed, but its' steady CPU temperature could be lower than that of a power-line-supplied notebook by slowing down the CPU frequency. 　It's also verified in the study that the sequence of thermal performance of cooling system is water-cooling > heat-pipe cooling > air-cooling. The thermal resistance of a cooling system isn't a fixed value, and it becomes smaller as the power consumption of CPU increases.