| Summary: | 碩士 === 國立成功大學 === 工程科學系專班 === 94 === Abstract
Recently, more and more optical or semiconductor devices are getting smaller by new generation production process. How to reduce packing cost will be an important issue for smaller devices. Conventional “pick & place” assembly methods will get the bottleneck to reduce the assembly cost. At that time, “pick and place “will not get used to assemble a large number of parts which scale is from micrometer to nanometer.
To accomplish efficient assembly of a very large number of small components and self- assembly methods will offer different ways to solve these problems. In business field, “Alien Tech company” using Fluidic Self-Assembly methods develop RFID packing technology.
This research, we will attempt to find out factors of FSA which effects binding rate. First we refer some related papers and choose 4 kinds of SAMs to coat the surface of silicon dioxide and substrate to compare the binding force. Then we designed and made the equipment to perform the FSA binding trial。
In the experiment condition, we use the 1mm×1mm SiO2 blocks as small devices and copper and electroplated Sn material as substrate. Tried to observe and find out important factors, which affect the binding rate mostly. Finally we modified coating SAMs methods and improve the trial steps to raise the binding rate.
The results show that how is important to choose suitable SAM、devices and substrate. And correct coating SAM methods and fluidic flowing field will be other important factors to affect FSA binding rate.
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