A Study on Dicing and Scribing Processes of Glasses

碩士 === 中興大學 === 機械工程學系所 === 94 === Glasses have good optical properties which can be applied to various optical devices such as optical lens and liquid crystal display. The demand of glasses is vast while still increasing year by year. As glasses are brittle materials with high hardness and extremel...

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Main Authors: Hung-Hsin Chen, 陳宏信
Other Authors: 蔡志成
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/13789790174295539049
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spelling ndltd-TW-094NCHU53110662015-10-13T16:41:01Z http://ndltd.ncl.edu.tw/handle/13789790174295539049 A Study on Dicing and Scribing Processes of Glasses 玻璃切割與刻劃製程之研究 Hung-Hsin Chen 陳宏信 碩士 中興大學 機械工程學系所 94 Glasses have good optical properties which can be applied to various optical devices such as optical lens and liquid crystal display. The demand of glasses is vast while still increasing year by year. As glasses are brittle materials with high hardness and extremely high fragility, it is common to damage the material, such as breakage, breach and crack, in the machining process. This research is aimed to investigate machining schemes for cutting glasses to reduce the damage in the processes. Ductile machining and brittle machining of glasses are first analyzed based on fracture mechanics. Experiments with different schemes including scribing-then-breaking, dicing-then-breaking, direct-dicing and two-step-dicing processes for soda lime glass and borosilicate glass are then conducted. Major results of this study include the followings. (i) Results by scribing experiments showed that critical depth of cut (DOC) for soda lime glass is between 0.4μm to 0.8μm and between 0.3μm to 0.5μm for borosilicate glass. The results match theoretical predictions based on fracture analysis that DOC for the soda lime glass and for the borosilicate glass are 0.78μm and 0.47μm respectively. (ii) The best machining scheme that results in least damage is the scribing-then-breaking process. The DOC of scribing, however, must be in the ductile-brittle region to generate a middle crack while avoiding lateral crack. (iii) Least damage can be achieved by reducing feed, increasing spindle speed in two-step-dicing process. (iv) Although back-surface defect can be avoided by dicing-then-breaking process, direction of crack generated in the process is not regular. Furthermore, size error can be induced as dicing width is higher than cracking width, not to mention that post grinding and lapping process must be employed to eliminate the scratches and burs. 蔡志成 2006 學位論文 ; thesis 54 zh-TW
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description 碩士 === 中興大學 === 機械工程學系所 === 94 === Glasses have good optical properties which can be applied to various optical devices such as optical lens and liquid crystal display. The demand of glasses is vast while still increasing year by year. As glasses are brittle materials with high hardness and extremely high fragility, it is common to damage the material, such as breakage, breach and crack, in the machining process. This research is aimed to investigate machining schemes for cutting glasses to reduce the damage in the processes. Ductile machining and brittle machining of glasses are first analyzed based on fracture mechanics. Experiments with different schemes including scribing-then-breaking, dicing-then-breaking, direct-dicing and two-step-dicing processes for soda lime glass and borosilicate glass are then conducted. Major results of this study include the followings. (i) Results by scribing experiments showed that critical depth of cut (DOC) for soda lime glass is between 0.4μm to 0.8μm and between 0.3μm to 0.5μm for borosilicate glass. The results match theoretical predictions based on fracture analysis that DOC for the soda lime glass and for the borosilicate glass are 0.78μm and 0.47μm respectively. (ii) The best machining scheme that results in least damage is the scribing-then-breaking process. The DOC of scribing, however, must be in the ductile-brittle region to generate a middle crack while avoiding lateral crack. (iii) Least damage can be achieved by reducing feed, increasing spindle speed in two-step-dicing process. (iv) Although back-surface defect can be avoided by dicing-then-breaking process, direction of crack generated in the process is not regular. Furthermore, size error can be induced as dicing width is higher than cracking width, not to mention that post grinding and lapping process must be employed to eliminate the scratches and burs.
author2 蔡志成
author_facet 蔡志成
Hung-Hsin Chen
陳宏信
author Hung-Hsin Chen
陳宏信
spellingShingle Hung-Hsin Chen
陳宏信
A Study on Dicing and Scribing Processes of Glasses
author_sort Hung-Hsin Chen
title A Study on Dicing and Scribing Processes of Glasses
title_short A Study on Dicing and Scribing Processes of Glasses
title_full A Study on Dicing and Scribing Processes of Glasses
title_fullStr A Study on Dicing and Scribing Processes of Glasses
title_full_unstemmed A Study on Dicing and Scribing Processes of Glasses
title_sort study on dicing and scribing processes of glasses
publishDate 2006
url http://ndltd.ncl.edu.tw/handle/13789790174295539049
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