| Summary: | 碩士 === 國立中興大學 === 機械工程學系所 === 94 === In this research the influence of surface condition of glass on electronic impedance of anisotropic conductive film (ACF) via chip-on-glass bonding process is investigate by experiments. Full experiments are designed and conducted at the first stage to investigate the effects of three effective factors, with three levels for each factor, selected from factor analysis. Samples from first stage are then sent to reliability tests at different environments to verify the stability of impedance. Influence of factors is evaluated by Analysis-of-Variance (ANOVA). Finally, a drag test was applied to ensure the bonding process.
COG bonding is achieved via proper bonding pressure on the ACF particles between the glass substrate and the IC. Observation by microscopic showed that ACF particles are squeezed and crashed in the process. The conducting film on the outer surface is in firm contact with the glass substrate and with the chip bump to form the conducting channel. Experimental results showed that the effect of conducting area on the conducting impedance reaches 73.41%. The conducting area for the ACF used in the experiment must be higher than 2000μm2 to achieve stable conducting impedance. Reliability tests showed that the better surface cleanliness, tested by wetting tension, the more stable conducting impedance. The effect of surface cleanliness of glass substrate on the reliability test is over 46%. Results from the drag tests showed that the adherent strength of ACF conductive particle on gold bump is higher than that on glass substrate.
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