An Investigation on The Effect of Surface Tension and Gravity on The Profile of Photoresist in Reflow Process

碩士 === 國立中興大學 === 機械工程學系所 === 94 === Photoresist has been widely used for forming patterns in different scales. When it solidifies from melting condition, for example by the reflow process, its profile deforms due to surface tension and gravity. This research is aimed to investigate the influence of...

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Bibliographic Details
Main Authors: Yung-Shun Hsu, 許泳順
Other Authors: 蔡志成
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/12868057608335271028