Thermal Analysis And Reliability Test For CMOS Image Sensor
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 94 === Due to huge demand for optical mouse, digital cameras, photo-mobile phones, web-cam and optoelectronic devices in home entertainment in recent years, the production and packaging techniques for CMOS image sensor (CIS) have been rapidly developed and improved....
Main Authors: | Hui-Yu Lee, 李輝宇 |
---|---|
Other Authors: | Hsiung-Chen Hsu |
Format: | Others |
Language: | zh-TW |
Published: |
2006
|
Online Access: | http://ndltd.ncl.edu.tw/handle/43014006181526943867 |
Similar Items
-
CMOS image sensor test method
by: HUANG, PO-CHIA, et al.
Published: (2019) -
The Characterization and Fabrication of Pyroelectric Infrared Sensor with CMOS Amplifier and Application of Thermal Image Array
by: Jian-Hsing Lee, et al.
Published: (2002) -
Reliability analysis of wafer-level chip-scale packaging technologies for CMOS image sensor
by: 陳自豪
Published: (2008) -
The Built-in Self-Test Scheme for CMOS Image Sensor Applications
by: Yu-Chih Lo, et al.
Published: (2011) -
The Simulation of 0.11um CMOS Technology for Back Side Illumination CMOS Image Sensor
by: Chen, Po-Yu, et al.
Published: (2015)