The Study of IC Packaging Industry Suppliers’ Performance Evaluation：Application of Data Envelopment Analysis

• Main Authors: Cheng-Kun Kuo, 郭正坤
• Other Authors: Hsiang-Lin Pu
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/12271867469535075325

碩士 === 義守大學 === 管理研究所碩士班 === 94 === Under the globalization tendency, the manufacturers expect to integrate the succession supply chain to save the cost in efficient way. According to this idea, the partnership of the suppliers relates to become more valuable. The relationship between supplier and manufacturer is not like the traditional hostile relation any more, but evolve to the close partnership, cooperating with few suppliers to insure the supply source of the high-quality and low cost. Therefore, the choice of the supplier even seems to be more important. This research is to use the CCR and BCC model by DEA that aims to select the productive variables to evaluate the management results of IC Substrate supplier of IC packaging industry from 2004 to 2005. The DEA efficiency value with cost is represented as a method for the evaluation of efficiency. In addition, it can improve related resource allotment and management. Because it provides the abundant management information, it is different from the traditional finance results and the alternative choice of the evaluation of single index sign. The conclusion of this research is to hope that it can provide the reference for IC packaging industry to understand the difference of production efficiency to IC substrate supplier. It also provides the decision maker or buyer to choose the most suitable IC substrate supplier, and to promote the industry competition ability.