A Numerical Study of the Warpage in IC Packaging by Taguchi Method

• Main Authors: Jian-Yu Chen, 陳建羽
• Other Authors: Sheng-Jye Hwang
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/89242815434898156461

碩士 === 逢甲大學 === 機械工程學所 === 94 === In the process of IC packaging, there are some problems about wire sweep、paddle shift and warpage…,etc. In the recorders, there are many research-reports about wire sweep and paddle shift while there are few in warpage about IC package. As the type of IC package is toward lighter, thinner and smaller, the problems about warpage and residual stress is more important. Previous research works have focused on the stresses or warpage analyses with temperature changes between constituent materials and neglect the cure shrinkage effects. However, more and more studies indicate that the estimation of residual stresses or warpage according to CTE only was not accurate enough to predict IC packaging behavior. So it would need to consider the heat effects and cure reaction in the same time for predicting the accurate warpage of IC packages by simulation in computer. The EMC is a thermosetting material. The properties of EMC must describe by pressure、volume、temperature and degree of cure. The relation is called P-V-T-C equation. In addition, the warpage will be influenced by mold temperature、process pressure、curing time…,etc. There are some results about predicting the warpage of IC package by simulation in computer recently, but the package outline is simple. So in this study, it were considered more complicated package outline. In the results of this study, the warpage will increase by higher mold temperature、higher process pressure and longer curing time which is the same with actual products. Keywords：IC package、warpage、residual stress、curing reaction、thermosetting material、P-V-T-C relation.