| Summary: | 碩士 === 逢甲大學 === 資訊電機工程碩士在職專班 === 94 === The first probe card, called a needle/epoxy ring probe card, was developed in 1969 and the same basic technology is still used today. However, the implementation of high performance probe becomes difficult with the conventional technology, because the number of per die increases and the pitch between pads decreases. In order to achieve those requirements, there have been several attempts to fabricate probe structure with batch silicon microfabrication process, since the dimensions of micromachined structures can easily be smaller than a few hundreds of micrometers. Some groups have so far developed MEMS type probe cards with various structures. However, those probes have several limitations: low contact force, short overdrive, complex process steps, and poor reliability. In other words, the critical problem of the micromachined probe cards is that each probe can not endures or produces the force required to break oxide on metal surface. In order to improve the above bottlenecks existing for getting better die test results, this research proposed a MEMS probe card that is composed of an array of Ni microprobes with out-of-plane predeformation using bulk micromachining and electroplating fabrication to solve the limitation of fine pitch and high frequency, and problem of silicon process.
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