The electrochemical properties of bias co-sputtered Cu6Sn5 thin film anodes

• Main Authors: Wei-yu Chen, 陳威佑
• Other Authors: Kun-ming Lin
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/92141244804917864265

碩士 === 逢甲大學 === 材料科學所 === 94 === Cu6Sn5 thin film anodes were prepared by using magnetron co-sputtering technique. In-situ substrate bias was applied to modify the surface morphology and crystallography of thin films, resulting in different electrochemical properties. The thin films crystallinity can be well controlled under precise substrate bias. Films deposited without substrate bias showed -Cu6Sn5 phase, with nanosized particles on the surface. The bias induced ion bombardment has resulted in structural evolution. As a negative bias of 150VDC during deposition, an -Cu6Sn5 phase formed, which was then confirmed by postcycled x-ray diffraction spectra. The electrochemical properties of thin film anodes deposited under various conditions were measured and compared. The un-bias deposited anodes showed high discharge capacity but exhibited 50% capacity fading after 50 charge-discharge cycles. The 150VDC bias deposited anodes show the lower initial reversible capacity, which however was stable during cycling test. The Copper surface coating with 10nm was deposited on the 0VDC films, and the cycling properties of 0VDC thin film anodes were improved significantly.