Development of A Novel Wafer-level Vacuum Packaging
碩士 === 逢甲大學 === 自動控制工程所 === 94 === Many micro electromechanical systems (MEMS) require a vacuum or controlled atmosphere encapsulation in order to ensure either a good performance or an acceptable lifetime of operation. This paper describes a novel wafer-level vacuum packaging method for MEMS which...
Main Authors: | , |
---|---|
Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2006
|
Online Access: | http://ndltd.ncl.edu.tw/handle/52061933592253862132 |