Development of A Novel Wafer-level Vacuum Packaging

碩士 === 逢甲大學 === 自動控制工程所 === 94 === Many micro electromechanical systems (MEMS) require a vacuum or controlled atmosphere encapsulation in order to ensure either a good performance or an acceptable lifetime of operation. This paper describes a novel wafer-level vacuum packaging method for MEMS which...

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Bibliographic Details
Main Authors: Hung-chung Li, 李鴻忠
Other Authors: none
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/52061933592253862132