Nanotribology behavior andMechanical Property of Thin Films forWafers

• Main Authors: Tsung-lin Wu, 吳宗霖
• Other Authors: Y.R. Jeng
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/15616090250027786705

碩士 === 國立中正大學 === 機械工程所 === 94 === The mechanical property of nano-scale is central for the development of nano science and technology. The mechanical property at the nano-scale can be different from that of bulk material due to effects such as surface effect, size effect and quantum effect. This study investigates the mechanical property and tribological performance of various material used in wafer with nano-scale interconnect including aluminium, nickel, silicon, tantalum and tantalum nitride. In the study, we used nanoindentation to study material property and tribological performance at nano-scale.We measure hardness and Young’s Modulus of material by Berkovich tips and friction coefficient and friction force by conical tips. Our results show that the nano-hardness increases as the indentation depths decreases into the nano range. The friction coefficient is constant in the elastic deformation regime. The friction coefficient increases with increasing load in the plastic deformation regime. The load between elastic and plastic deformation is called critical load. Our testing indicates that material with higher hardness generally lead to higher critical load. The friction coefficient is constant if velocity less than critical velocity. The friction coefficient increases with increasing velocity if velocity is larger than critical velocity. The critical velocity is between 0.20~0.33μm/s for different material. The critical load and friction coefficient will be different when using different tips. Larger radius of the tip results in smaller friction coefficient and larger critical load. The friction force is proportional to the peripheral contact area regardless the deformation is elastic or plastic.