Electronic Speckle Pattern Interferometry Applied to the Three-dimensional Displacement Measurement in Sandwich Plates with Insert and Potting Materials

• Main Authors: Hung-jen Yeh, 葉宏仁
• Other Authors: Song-jeng Huang
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/13211310784373849692

碩士 === 國立中正大學 === 機械工程所 === 94 === Sandwich honeycomb structures are used extensively for aircraft structures and flying vehicles, due to which have the advantage of characteristic for low mass and could be accept higher strength, and structure of the sandwich honeycomb plate with potting material and insert which can increase the strength of the structure, improve the local stress concentration and increase the loading point. This research presents the construction and operation of an electronic speckle pattern interferometry (ESPI) applied to sandwich plates with inserts. Proposed ESPI is a full-field and non-destructive testing that can measures tiny out-of-plane and in-plane displacement in the elastic region. The experimental construction is to integrate out-of-plane and in-plane measurement into an optical system, to measure the three-dimensional displacement of the sandwich plates. There are two main results of the experiment. The first result indicates that the strength of the sandwich plate will increase as the core thickness is increasing, but the displacement will decrease. The second result indicates that the displacement will decrease as the diameter of insert is increasing, but the strength will increase. For validation purpose, the analytical analysis was introduced to compare with the result of ESPI. Comparison between the results of ESPI and analytical revealed a convincing agreement. The results of this study could be applied on designing the sandwich structure with insert in the future.