The Effects of Underfill’s Characteristics on the Thermal Deformation of FCBGA Components
碩士 === 元智大學 === 機械工程學系 === 93 === ABSTRACT With the evolution of electronic technology, the size of the electronic product is getting smaller and the function is getting stronger. The reliability of the products becomes more and more important. In the packaging process, there are multiple layers...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52028839926274630024 |